Primary Duties & Responsibilities Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production. Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and
Agility’s commercially deployed humanoids operate alongside teams in warehouses, manufacturing facilities, and distribution centers—tackling physically demanding and repetitive tasks while enabling workers to focus on higher-value work. With industry-leading safety standards and years of proven deployment data,
Agility’s commercially deployed humanoids operate alongside teams in warehouses, manufacturing facilities, and distribution centers—tackling physically demanding and repetitive tasks while enabling workers to focus on higher-value work. With industry-leading safety standards and years of proven deployment data,
Agility’s commercially deployed humanoids operate alongside teams in warehouses, manufacturing facilities, and distribution centers—tackling physically demanding and repetitive tasks while enabling workers to focus on higher-value work. With industry-leading safety standards and years of proven deployment data,
Agility’s commercially deployed humanoids operate alongside teams in warehouses, manufacturing facilities, and distribution centers—tackling physically demanding and repetitive tasks while enabling workers to focus on higher-value work. With industry-leading safety standards and years of proven deployment data,
Primary Duties & Responsibilities Develop and enhance automated test execution frameworks for firmware and system-level validation. Support automation for customer issue replication, debug workflows, and release qualification. Document FIRE, SRT and EUI5 architecture, frameworks, APIs workflows, troubleshooting
Primary Duties & Responsibilities Provide technical leadership for the development, implementation, and continuous improvement of silicon photonics wafer-level test and characterization methodologies for photonic integrated circuits (PICs) and associated test structures. Develop and optimize wafer-level characterization
Primary Duties & Responsibilities Lead the development of die-level silicon photonics test and characterization strategies, from early device characterization through product qualification and manufacturing readiness. Architect and develop automated electro-optical and RF test platforms for silicon