Hybrid Bonder Equipment Development Director 新加坡 全职 生产 / 制造 / 加工 - 电子 / 电器 / 半导体 / 仪器 / 仪表 职位描述 Location: Singapore (Local Hire) 工作地点：新加坡 本地直招Industry: Semiconductor Advanced Packaging 行业：半导体先进封装Job Responsibilities 岗位职责Lead local Hybrid Bonding
HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing,
About this Position The jobholder has overall responsibilityglobally for the Mobile/Telecom/5G cluster market strategy, which includes alltypes of adhesives, encapsulants and thermal management materials used in theconstruction of semiconductor packages. The jobholder is responsible for thefurther
OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the