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Hybrid Bonder Equipment Development Director 新加坡 全职 生产 / 制造 / 加工 - 电子 / 电器 / 半导体 / 仪器 / 仪表 职位描述 Location: Singapore (Local Hire) 工作地点:新加坡 本地直招Industry: Semiconductor Advanced Packaging 行业:半导体先进封装Job Responsibilities 岗位职责Lead local
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