Job Details: Job Description: As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling next-generation advanced packaging technologies that enable Intels leadership in high-performance computing, AI, and chiplet architectures.
NVIDIA is a global leader in high-speed computer vision, artificial intelligence (AI), and deep learning. Our team develops data engineering solutions that empower AI developers in autonomous vehicle (AV) domains to innovate quickly and effectively at scale.
Job Details: Job Description: The Role and Impact As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intels leadership in advanced packaging for