1 – 2 of 2 jobs
Job Details: Job Description: As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling next-generation advanced packaging technologies that enable Intels leadership in high-performance computing, AI,
Job Details: Job Description: The Role and Impact As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intels leadership in advanced packaging for
Recommended jobs for you
